Analysis of electrical parameters of InGaN-based LED packages with aging - ScienceDirect
Schematic of a deep UV LED heterostructure flip-chip mounted onto a... | Download Scientific Diagram
Human-centric lighting placing greater demands on LED... Smart2.0
nanoplus | Mid-Infrared LEDs: 4000 nm - 5300 nm
A) Submount with separated 1mm 2 flip-chip LEDs. The inset shows a... | Download Scientific Diagram
Submount for high power LED 1-Submount for high power LED-Huabo(Suzhou) Thinfilm Technology Co.,ltd.
ZEISS Microscopy Online Campus | Light-Emitting Diodes
LED output doesn't dwindle | Laser Focus World
Thermal characteristics and fabrication of silicon sub-mount based LED package - ScienceDirect
LED Submount - Remtec
Lumileds talks LED packaging - interview
Laser & Photo Diode Submounts | Thick & Thin Metallization | Plated Copper
Submounts and Subcarriers | Components for Fiber-Optic Communication Modules | Ceramic Packages | Products | KYOCERA
Human-centric lighting placing greater demands on LED... Smart2.0
Submounts and Subcarriers | Components for Fiber-Optic Communication Modules | Ceramic Packages | Products | KYOCERA
LED Substrates and Submounts | Cost Effective Ceramic Packaging
OSA | A novel integrated structure of thin film GaN LED with ultra-low thermal resistance
Examine the heated question of chip-scale packaging in the LED industry (MAGAZINE) | LEDs Magazine
AN033_Processing of LEDs - Information on the multi-chip ceramic OSLON Submount CL LEDs.fm
OSLON® Submount CL, KW C3L5L1.TE | OSRAM Opto Semiconductors
About LED - Reno LED Lighting
GaN-based mid-power flip-chip light-emitting diode with high −3 dB bandwidth for visible light communications
Application of micro/nano technology for thermal management of high power LED packaging – A review - ScienceDirect
